1～5 item / All 5 items
Compact and powerful computer on module equipped with 6th generation Intel Core/Celeron.
【Main Features of This Product】 ◆ 6th Generation Intel Core i7 / i5 / i3 / Celeron built-in PCH-LP ◆ Supports dual-channel DDR3L 1600 SODIMM up to 16GB (1 socket on top, 2 sockets on the bottom) ◆ Supports up to 3 simultaneous displays: LVDS / DisplayPort / HDMI / VGA ◆ Compatible with iManager SUSIAccess and embedded software API
Equipped with Intel Xeon D, capable of operating in harsh environments! Robust COM Express Type 7 module.
【Main Features of the Product】 ◆ COM Express R3.0 Basic Module Type 7 pin layout ◆ Intel Xeon Processor D-1500 product family ◆ Size: 125 x 95 mm ◆ ECC-equipped solder-down memory ◆ High-speed Ethernet (dual 10GBASE-KR interface, 1x GbE) ◆ Rich expansion (PCIe x16, PCIe x8, 8 PCIe x1) ◆ Supports iManager, WISE-PaaS / DeviceOn, and embedded software APIs
"Elkhart Lake equipped" x86 & RISC design for large-scale deployment of IoT devices!
**Main Features of the Product** ◆ SMARC V2.1 standard module equipped with Intel Elkhart Lake processor ◆ Supports up to 16GB of LPDDR4 (3200MT/s) with IBECC, 2 to 4 core CPU for specific SKUs ◆ 3x independent displays: LVDS (1920 x 1200 @ 60Hz / eDP), DP++ (up to 4096×2160 @ 60 Hz), and HDMI (up to 3840x2160 @ 30 Hz, 4096×2160 @ 60 Hz) ◆ 4x PCIe x1, 2x GbE LAN supporting TSN, 2x USB 3.2 GEN2, 4x USB 2.0, 14x GPIO ◆ 1x UFS onboard, 1x SATA III ◆ Operating temperature: Standard 0 to 60°C, Extended -40 to 85°C ・Compatible with Advantech iManager & WISE-DeviceOn
COM Express Type 6 module with 8th/9th generation Intel Core/Xeon/Celeron.
【Main Features of This Product】 ◆ Equipped with 8th/9th generation Intel Xeon/Core hexa/quad-core ◆ Dual-channel DDR4, up to 96GB (ECC option) ◆ High-speed I/O connections: 4x USB3.1 (Gen2), 8x PCIex1 (Gen3), 4x SATA (Gen3) ◆ Supports up to 3 independent displays (4K) ◆ Supports iManager, WISE-Device-On, embedded software API, Edge AI Suite
![[COM-HPC] Embedded CPU Board "SOM-E781"](https://image.mono.ipros.com/public/product/image/56c/2001512573/IPROS17029001125072111594.png?w=280&h=280)
Computer on Module with AMD EPYC Embedded 8004 Series
The "SOM-E781" provides server-grade performance with an optimized proprietary pin layout that supports 572W of power based on the specifications of COM-HPC Server Size E. With the inclusion of the AMD EPYC Embedded 8004 series, it achieves a TDP (thermal design power) of 200W while supporting up to 576GB of large-capacity memory and up to 79 PCIe lanes operating at Gen5 (the standard COM-HPC Server Size E supports 64 lanes).
